Radical Nitriding
What is Radical Nitriding?
Radical nitriding is a surface treatment method that utilizes highly reactive nitrogen radicals (NH)* generated in a low-voltage plasma environment. By applying a mixture of hydrogen (H₂) and ammonia (NH₃) gases, and precisely controlling the current density, it is possible to adjust the nitrided layer depth and the surface roughness after treatment. This process allows for controlled and selective surface hardening through low-energy plasma reactions.
Key Advantages of Radical Nitridin
Excellent Surface Finish and Selective Diffusion Layer Formation : Enables formation of a high-hardness diffusion layer without a compound layer, while maintaining superior surface roughness.
Controlled Compound Layer Formation : Allows precise control over the formation and thickness of the surface compound layer.
Prevention of Scratches and Heat Cracks : Reduces the risk of surface defects such as scratches and thermal cracking.
Extended Tool and Die Life : Significantly improves the service life of molds and tooling components.
Uniform Treatment in Narrow Gaps and Complex Geometries : Ensures consistent nitriding even in tight clearances and intricate shapes.
Applicable to Precision Molds for Semiconductors : Suitable for high-precision molds used in semiconductor manufacturing.